Brand Name : ACCPCB
Model Number : S10-0011B
Certification : ISO, UL, SGS,TS16949
Place of Origin : China
MOQ : 1PCS
Price : Negotiable
Payment Terms : L/C / T/T / Western Union / Paypal
Delivery Time : 10-12days
Packaging Details : Vacuum packing with desiccant
Count : 12Layer
Material : FR4 high TG
Pcb standard : IPC-A-610 E Class II-III
Copper thickness : 1oz
Service : One-stop Service OEM
OEM 12 Layer Multilayer Circuit Board Service 2.2mm Thickness SMT Assemble
Layer : | 12 Layers |
Base Material : | FR4 high tg |
Copper Thickness : | 1 oz in all layer |
Board Thickness : | 2.2 0 mm |
Min. Hole Size : | 6 mil, 0.15mm |
Min. Line Width : | 5 / 5 mil |
Min. Line Spacing : | 5 / 5mil |
Surface Finishing : | ENGIN |
Drilling hole tolerance: | +/-3 mil ( 0.075mm ) |
Outline profile: | Punching, Routing , CNC routing + V-cut |
Min Outline tolerance : | +/-4 mil ( 0.10mm ) |
Certificate : | UL, CQC, TS16949, ISO14000, ROHS |
Twist and Bow : | no more than 0.75% |
Advantages :
• Strict product liability, taking IPC-A-160 standard
• Engineering pretreatment before production
• Production process control (5Ms)
• 100% E-test, 100% visual inspection, including IQC, IPQC, FQC, OQC
• 100% AOI inspection, including X-ray, 3D microscope and ICT
• High-voltage test, impedance control test
• Micro section, soldering capacity, thermal stress test, shocking test
• In-house PCB production
• No minimum order quantity and free sample
• Focus on low to medium volume production
• Quick and on-time delivery
Technical Capability:
ITEMS | Capability |
Max. layer count | 28L |
Min. line widty | 0.08mm |
Min. line spacing | 0.08mm |
Min. hole size | 0.15mm |
Board thickness | 0.4-6.0mm |
Max. boardsize | 520×620mm |
(PTH) Hole size tolerance(PTH) | ±0.075mm |
(NPTH) Hole size tolerance(NPTH) ) | ±0.05mm |
Holeposition tolerance(Routing) | ±0.1mm |
Outline tolerance(Punching) | ±0.1mm |
FAQ :
1. What kinds of boards can ACCPCB process?
Common FR4, high-TG and halogen-free boards, Rogers, Arlon, Telfon, aluminum/copper-based boards, PI, etc.
2. What data are needed for PCB production?
PCB Gerber files with RS-274-X format.
3. What’s the typical process flow for multi-layer PCB?
Material cutting → Inner dry film → inner etching → Inner AOI → Multi-bond→ Layer stack up Pressing → Drilling → PTH → Panel Plating → Outer Dry Film → Pattern Plating → Outer etching → Outer AOI → Solder Mask → Component Mark → Surface finish → Routing → E/T → Visual Inspection.
4. How many types of surface finish ACCPCB can do?
the leader has the full series of surface finish, such as: ENIG, OSP, LF-HASL, gold plating (soft/hard), immersion silver, Tin, silver plating, immersion tin plating, carbon ink and etc. .. OSP, ENIG, OSP + ENIG commonly used on the HDI, we usually recommend that you use a client or OSP OSP + ENIG if BGA PAD size less than 0.3 mm.
5. What are the main factors which will affect the price of PCB?
Material;
Surface finish;
Board thickness, Copper thickness;
Technology difficulty;
Different quality criteria;
PCB characteristics;
Payment terms;
6. How do ACCPCB ensure quality?
Our high quality standard is achieved with the following.
1.1 The process is strictly controlled under ISO 9001:2008 standards.
1.2 Extensive use of software in managing the production process
1.3 State-of-art testing equipments and tools. E.g. Flying Probe,e-Testing, X-ray Inspection, AOI (Automated Optical Inspector) .
1.4.Dedicated quality assurance team with failure case analysis process
OEM 12 Layer Multilayer Circuit Board Service 2.2mm Thickness SMT Assemble Images |