Nanya FR4 TG170 Material multi layer pcb fabrication with Black Soldermask for smartphone application
Key Specifications/Special Features:
| Layer : | 4 Layers |
| Base Material : | FR4tg150 |
| Copper Thickness : | 1 / 1 /1 / 1 oz |
| Board Thickness : | 1.20mm |
| Min. Hole Size : | 6 mil, 0.15mm |
| Min. Line Width : | 4/4 mil, 0.075/0.075 mm |
| Min. Line Spacing : | 4/4mil, 0.075/0.075 mm |
| Surface Finishing : | ENIG |
| Cooper thickness in holes: | 0.020-0.035mm |
| Solder mask: | LPI solder mask , peelable mask |
| Outline profile: | punching, CNC routing |
| outline tolerance: | 0.127mm |
| twist and bow: | 0.5-0.75% |
| impedance control: | +/-10% |
| Aspect Ratio: | 10:1(max) |
PCB Flow Chart.pdf
Advantages :
• Strict product liability, taking IPC-A-160 standard
• Engineering pretreatment before production
• Production process control (5Ms)
• 100% E-test, 100% visual inspection, including IQC, IPQC, FQC, OQC
• 100% AOI inspection, including X-ray, 3D microscope and ICT
• High-voltage test, impedance control test
• Micro section, soldering capacity, thermal stress test, shocking test
• In-house PCB production
• No minimum order quantity and free sample
• Focus on low to medium volume production
• Quick and on-time delivery
Technical Capability:
| ITEMS | Capability |
| Max. layer count | 28L |
| Min. line widty | 0.08mm |
| Min. line spacing | 0.08mm |
| Min. hole size | 0.15mm |
| Board thickness | 0.4-6.0mm |
| Max. boardsize | 520×620mm |
| (PTH) Hole size tolerance(PTH) | ±0.075mm |
| (NPTH) Hole size tolerance(NPTH) ) | ±0.05mm |
| Holeposition tolerance(Routing) | ±0.1mm |
| Outline tolerance(Punching) | ±0.1mm |
FAQ:
1. What kinds of boards can ACCPCB process?
Common FR4, high-TG and halogen-free boards, Rogers, Arlon, Telfon, aluminum/copper-based boards, PI, etc.
2. What data are needed for PCB production?
PCB Gerber files with RS-274-X format.
3. What’s the typical process flow for multi-layer PCB?
Material cutting → Inner dry film → inner etching → Inner AOI → Multi-bond→ Layer stack up Pressing → Drilling → PTH → Panel Plating → Outer Dry Film → Pattern Plating → Outer etching → Outer AOI → Solder Mask → Component Mark → Surface finish → Routing → E/T → Visual Inspection.
4. How many types of surface finish ACCPCB can do?
the leader has the full series of surface finish, such as: ENIG, OSP, LF-HASL, gold plating (soft/hard), immersion silver, Tin, silver plating, immersion tin plating, carbon ink and etc. .. OSP, ENIG, OSP + ENIG commonly used on the HDI, we usually recommend that you use a client or OSP OSP + ENIG if BGA PAD size less than 0.3 mm.
5. How do ACCPCB ensure quality?
Our high quality standard is achieved with the following.
1.1 The process is strictly controlled under ISO 9001:2008 standards.
1.2 Extensive use of software in managing the production process
1.3 State-of-art testing equipments and tools. E.g. Flying Probe,e-Testing, X-ray Inspection, AOI (Automated Optical Inspector) .
1.4.Dedicated quality assurance team with failure case analysis process
Product Tags:
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Nanya FR4 TG170 Material Multi Layer Pcb Fabrication Black Soldermask For Smartphone Images
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