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14 Layer 2oz Copper Multilayer Circuit Board For Remote Control Device

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14 Layer 2oz Copper Multilayer Circuit Board For Remote Control Device

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Brand Name : ACCPCB

Model Number : S102121

Certification : ISO,SGS,TS16949

Place of Origin : China

MOQ : 1 PCS

Price : Negotiable

Payment Terms : T/T ,Western Union,Paypal

Supply Ability : 50000SQ.M/Per Month

Delivery Time : 3-5days

Packaging Details : Vacuum packing

Material : KB FR4

Count : 14 layer

Surface Finish : Immersion gold

Application : remote control device

Solder Mask : Blue,Green,black, yellow etc.

Copper thickness : 2oz all layer

Min. hole size : 8 mil

Min. line spacing : 4mil

Min. line width : 4mil

Service : Customized PCB

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14 Layer 2oz Copper Multilayer Circuit Board For Remote Control Device

Production description :

this board is 14 layer for remote control device. PCB prototype,samll volum, middle and large volume are accepted. no MOQ request for new boards, for repeat order, just meet 3sq.m.

Key Specifications of tablet PCB board​ :

Production Types:

Rigid PCB

Layer :

14 L

Base Material :

KB FR4

Copper Thickness :

2oz

Board Thickness :

0.4mm

Min. Finish Hole Size :

8 mil (0.20mm)

Min. Line Width :

4 mil

Min. Line Spacing :

4 mil

Surface Finishing :

ENIG,OSP,HASL,Immersion Gold,Gold Plating

Drilling hole tolerance:

+/-3 mil ( 0.075mm )

Min Outline tolerance :

+/-4 mil ( 0.10mm )

Working panel size :

max:1200mmX600mm (47'' X24'')

Outline profile:

Punching, Routing , CNC routing + V-cut

Solder mask :

LPI Solder mask, Peelable mask

Solder Mask Color :

Blue, black,yellow, matte green

Certificate :

UL, CQC, TS16949, ISO14000, ROHS

Silkscreen color :

White

Twist and Bow :

no more than 0.75 %

PCB Flow Chart.pdf

Products Application:

1, Telecom Communication
2, Consumer Electronics
3, Security monitor
4, Vehicle Electronices
5, Smart Home
6, Industrial controls
7, Military & Defense

14 Layer 2oz Copper Multilayer Circuit Board For Remote Control Device

Technology Capability:

Item

Technical Parameters

Layers

1-28 Layers

Inner Layer Min Trace/Space

4/4 mil

Out Layer Min Trace,Space

4/4 mil

Inner Layer Max Copper

4 OZ

Out Layer Max Copper

4 OZ

Inner Layer Min Copper

1/3 oz

Out Layer Min Copper

1/3 oz

Min hole size

0.15 mm

Max.board thickness

6 mm

Min.board thickness

0.2mm

Max.board size

680*1200 mm

PTH Tolerance

+/-0.075mm

NPTH Tolerance

+/-0.05mm

Countersink Tolerance

+/-0.15mm

Board Thickness Tolerance

+/-10%

Min BGA

7mil

Min SMT

7*10 mil

Solder mask bridge

4 mil

Solder mask color

White,black,blue,green,yellow,red,etc

Legend color

White,black,yellow,gray,etc

Surface finish

HAL,OSP, Immersion Ni/Au ,Imm silver/SN,ENIG

Board materials

FR-4;high TG;HighCTI; halogen free; Aluminum Bsed PCB,high frequency(rogers,isola),copper -base PCB

Impedance control

+/-10%

Bow and twist

≤0.5

14 Layer 2oz Copper Multilayer Circuit Board For Remote Control Device

FAQ :

1. What kinds of boards can ACCPCB process?

Common FR4, high-TG and halogen-free boards, Rogers, Arlon, Telfon, aluminum/copper-based boards, PI, etc.

2. How do ACCPCB ensure quality?

Our high quality standard is achieved with the following.

1.1 The process is strictly controlled under ISO 9001:2008 standards.
1.2 Extensive use of software in managing the production process
1.3 State-of-art testing equipments and tools. E.g. Flying Probe,e-Testing, X-ray Inspection, AOI (Automated Optical Inspector) .
1.4.Dedicated quality assurance team with failure case analysis process

3. What data are needed for PCB production?

PCB Gerber files with RS-274-X format.


4. What’s the typical process flow for multi-layer PCB?

Material cutting → Inner dry film → inner etching → Inner AOI → Multi-bond→ Layer stack up Pressing → Drilling → PTH → Panel Plating → Outer Dry Film → Pattern Plating → Outer etching → Outer AOI → Solder Mask → Component Mark → Surface finish → Routing → E/T → Visual Inspection.


5. How many types of surface finish ACCPCB can do?

O-the leader has the full series of surface finish, such as: ENIG, OSP, LF-HASL, gold plating (soft/hard), immersion silver, Tin, silver plating, immersion tin plating, carbon ink and etc. .. OSP, ENIG, OSP + ENIG commonly used on the HDI, we usually recommend that you use a client or OSP OSP + ENIG if BGA PAD size less than 0.3 mm.



Product Tags:

2oz Copper Multilayer Circuit Board

      

KB FR4 Multilayer Circuit Board

      

2oz 14 Layer Circuit Board

      
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